JOB Description 1.) Device Engineer (Logicand Memory) Title: Device Engineer
Job Responsibilities ² Define and designdevices (MOS, BJT, Capacitor, Resistor, Diode, Inductor, SRAM, OTP/MTP, EEPROM,Flash etc.) architectures for deep submicron technologies; ² Design the devicestestkeys/monitor structures for new technology and new devices development,characterization and qualification; ² Do systematic design ofexperiment for process and device development; ² Interact with TCADengineers to guide them for new device/process simulation and get the estimatedvalid process conditions; ² Work with integrationengineers to design the process flow and/or unit process for the new Devices; ² Measure electricalcharacteristics of the devices such as MOS, BJT, Capacitor, Resistor, Diode,Inductor etc. ² Monitor process trendon WAT SPC; ² Be responsible tointeract with internal & external customers and respond to customers’technical queries; ² Innovate new methods ofcontinuous device improvements; ² Determine and maintainthe electrical design rules; ² Obtain competitiveadvantages and exclusive rights by writing papers and patents; ² Provide mentorship tofresh (device/integration) engineers/AEs; ² Other works involvedactivities covering the entire device development spectrum.
Experience Requirements ² At least 5 years of TDdevice engineering experience in semiconductor industry; ² Familiar withsemiconductor process/device, including CMOS, Bipolar, Diode, Resistors,Capacitors etc. and understand the device physics and reliability for thesestructures; ² Familiar with wafer fabpractice and an understanding over the electrical versus process trade off fordevices; ² Experience working withTCAD teams; ² Familiar withsemiconductor test methods; ² Understand reliabilitymechanism; ² Strong capabilities ofproblem analysis and diagnosis techniques; ² Understand statisticsand DOE.
Educational Requirements ² B.S., M.S., PhD in ME,EE, or Physics
Qualifications ² Must be a selfstarterwho can work both independently and in groups; ² Strong communication capabilityin both English and Chinese; ² Strong learningcapability; ² Good team player. 2.) Process Integration Engineer Job Responsibilities ² Develop or integratethe process flow for new technology or devices, which meet product'srequirements; ² Work with Unit ProcessModule group to develop new process recipes and insure new recipes aremanufacturable; ² Design thetestkeys/monitor structures for new technology and new devices development,characterization and qualification; ² Perform failureanalysis, line issues cleanup and yield enhancement; ² Monitor process trendon inline/WAT SPC and product yield; ² Process benchmark withother fab; ² Determine and maintainthe topological and electrical design rules; ² Measure electricalcharacteristics of the devices such as MOS, BJT, Capacitor, Resistor, Diodeetc. ² Work with DesignService engineer to create CAD environment, for example DRC, LVS, SpiceModels, PDK; ² Obtain competitiveadvantages and exclusive rights by writing papers and patents; ² Be responsible tointeract with internal & external customers and respond to customers’technical queries. ² Transfer new technologyto manufacture; ² Provide mentorship tofresh (device/integration) engineers/AEs; ² Other works involvedactivities covering the entire process development spectrum.
Experience Requirements ² At least 5 years of TDintegration experience in semiconductor industry; ² Familiar withsemiconductor manufacture and CMOS process integration; ² Experience working withdesign and application teams, knowledge on design rules ( physical andelectrical ); ² Familiar withsemiconductor test methods; ² Understand reliabilitymechanism; ² Strong capabilities ofproblem analysis and diagnosis techniques; ² Understand statisticsand DOE.
Educational Requirements ² B.S., M.S., PhD in ME,EE, or Physics
Qualifications ² Must be a selfstarterwho can work both independently and in groups; ² Strong communicationcapability in both English and Chinese; ² Strong learningcapability; ² Good team player.
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